Learn what CoWoS, HBM, FOWLP, GAAFET, Chiplet, RDL, and 2.5D packaging mean. This guide helps you grasp the essential technologies behind AI, chips, and advanced semiconductor integration.

Explore TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) technology in detail, including process steps, interposer design, TSV, RDL, and real-world applications in AI and high-performance computing systems.

Explore the structural differences, applications, and future trends of CoWoS and InFO—TSMC’s leading advanced packaging technologies. This in-depth guide compares thermal performance, power handling, and integration density to help engineers make informed decisions.

This article will cover the fundamental principles of CoWoS technology, its application areas, market prospects, and the impact of this tech